Patent Assignment
Reel/Frame 058664/0544
Change of Name
Recorded: 2022-01-07
Pages: 58
Assignor
TOSHIBA MEMORY CORPORATION
Executed: 2019-10-01
Assignee
KIOXIA CORPORATION
1-21, SHIBAURA 3-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Properties
(33)
Semiconductor Memory Device and Method for Manufacturing Same
Semiconductor Memory Device and Method for Manufacturing Same
Semiconductor Device and Method for Manufacturing Same
Semiconductor Device Having Chip Stacked and Molded
Semiconductor Memory Device and Method for Manufacturing Same
Memory Device
Semiconductor Memory Device
Semiconductor Device
Semiconductor Device and Method of Manufacturing the Same
Semiconductor Memory Device and Method for Manufacturing the Same
Semiconductor Device and Method for Manufacturing Same
Semiconductor Device having a Pad Proximate to a Step Structure Section of an Array Chip
Semiconductor Memory Device Including Integrated Control Circuit and Solid-State Drive Controller
Semiconductor Memory Device
Non-Volatile Memory Device
Semiconductor Memory Device
Semiconductor Memory Device and Method for Manufacturing Same
Semiconductor Device
Semiconductor Memory Device Including a Substrate, Various Interconnections, Semiconductor Member, Charge Storage Member and a Conductive Member
Semiconductor Device
Semiconductor Device and Method for Manufacturing Same
Stacked Type Semiconductor Memory Device with Varying Widths in the Insulating Member and Pillars
Nonvolatile Semiconductor Memory Device and Method for Manufacturing Same
Memory Device
Application:
17/242,870 →
Publication:
US 2021/0249440
Semiconductor Memory Device and Method for Manufacturing Same
Stacked-Type Semiconductor Memory Device
Semiconductor Memory Device and Method for Manufacturing the Same
Semiconductor Memory Device
Transfer Molding Method with Sensor and Shut-Off Pin
Semiconductor Memory Device
Semiconductor Memory Device
Plasma Treatment Apparatus, Semiconductor Manufacturing Apparatus, and Manufacturing Method of Semiconductor Device
Application:
17/483,052 →
Publication:
US 2022/0013367
Method for Manufacturing Semiconductor Device Having Chip Stacked and Molded
Related Assignments
(5)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 27, 2017
From: KATO, TATSUYA; ARAI, FUMITAKA; SEKINE, KATSUYUKI; IWAMOTO, TOSHIYUKI
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 044221/0874 →
Assignment of Assignor's Interest
Jan 23, 2018
From: SEKINE, KATSUYUKI; KATO, TATSUYA; ARAI, FUMITAKA; IWAMOTO, TOSHIYUKI
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 044701/0860 →
Assignment of Assignor's Interest
Jan 25, 2019
From: TAJIMA, TAKAYUKI; SHIMOKAWA, KAZUO
To: KABUSHIKI KAISHA TOSHIBA; TOSHIBA MEMORY CORPORATION
Reel/Frame 048129/0439 →
Assignment of Assignor's Interest
Mar 15, 2019
From: TAJIMA, TAKAYUKI; SHIMOKAWA, KAZUO
To: KABUSHIKI KAISHA TOSHIBA; TOSHIBA MEMORY CORPORATION
Reel/Frame 048608/0191 →
Merger and Change of Name
Jan 7, 2022
From: TOSHIBA MEMORY CORPORATION; K.K. PANGEA
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 058664/0198 →