IP Library Granted Patent US 11,176,999
Granted Patent B2
US 11,176,999 · App. 17/142,860 · Granted Nov 16, 2021

Semiconductor memory device

Inventors: Noboru Shibata (Kawasaki, JP); Kazuaki Isobe (Yokohama, JP)
Assignee: TOSHIBA MEMORY CORPORATION
G11C16/0483G11C7/1006G11C11/5628G11C11/5635G11C11/5642G11C16/0408G11C16/0466G11C16/08G11C16/10G11C16/14G11C16/26H01L23/528H01L27/1157H01L27/11524H01L27/11556H01L27/11582H01L21/28568H01L21/31116H01L21/76802H01L21/76879H01L29/7883H01L29/7889H01L29/7926
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Quick Facts
Patent No.
US 11,176,999
App. No.
17/142,860
Granted
Nov 16, 2021
Kind
B2
Abstract

According to one embodiment, a semiconductor memory device includes first to nth string units (n being a natural number of 3 or more), a plurality of layers of word lines, and (n−1) layers of select gate layers. The first to nth string units each includes a memory string. The memory string includes a plurality of memory cells and a plurality of select transistors connected in series in a first direction. The (n−1) layers of select gate layers include first to (2×(n−1))th select gates electrically isolated from each other. The first string unit is selected by the first to (n−1)th select gates. The kth string unit (k being not less than 1 and not more than n) is selected by the kth to (n+k−2)th select gates. The nth string unit is selected by the nth to (2×(n−1))th select gates.

Claims (55)

1. A semiconductor memory device, comprising first to nth memory cells, n being a natural number, the first to nth memory cells each having a plurality of thresholds,

the first to nth memory cells being selected simultaneously in a read operation,

after the read operation, k pieces of read data, k being n or less, being determined from n pieces of data read from the first to nth memory cells, wherein

the first to nth memory cells are each provided in first to nth memory strings.

2. The device according to claim 1 , wherein

the first to nth memory cells include a first state, a second state, a third state, and an hth state, h being 3 or more,

the first state and the second state are discriminated by applying a first read voltage to gates of the first to nth memory cells,

the second state and the third state are discriminated by applying a second read voltage to the gates of the first to nth memory cells,

the (h-l)th state and the hth state are discriminated by applying th read voltage to the gates of the first to nth memory cells, and

a voltage of the first to (h- 1 )th read voltages is applied to the first to nth memory cells in the read operation.

3. The device according to claim 1 , wherein

first to nth word lines are each connected to the first to nth memory cells, and

first to nth voltages are each applied to the first to nth word lines.

4. The device according to claim 3 , wherein

first to nth bit lines are each connected to the first to nth memory strings, and

first to nth sense amplifiers are each connected to the first to nth bit lines.

5. The device according to claim 1 , wherein the n is 3, and the k is 3.

6. A semiconductor memory device, comprising a first memory cell and a second memory cell, the first memory cell and the second memory cell each having a plurality of thresholds,

the first memory cell and the second memory cell being selected simultaneously in a read operation,

after the read operation, one piece of read data is determined from first data read from the first memory cell and second data read from the second memory cell.

7. The device according to claim 6 , wherein

the first memory cell and the second memory cell each include a first state, a second state, and a third state,

the first state and the second state are discriminated by applying a first read voltage to a gate of the first memory cell and a gate of the second memory cell,

the second state and the third state are discriminated by applying a second read voltage to the gate of the first memory cell and the gate of the second memory cell,

first read operation is performed by applying the first read voltage to the first memory cell and applying the first read voltage to the second memory cell,

second read operation is performed by applying the first read voltage to the first memory cell and applying the second read voltage to the second memory cell, and

third read operation is performed by applying the second read voltage to the first memory cell and applying the first read voltage to the second memory cell.

8. The device according to claim 6 , wherein

the first memory cell is provided in a first memory string, and

the second memory cell is provided in a second memory string.

9. The device according to claim 8 , wherein

a first word line is connected to the first memory cell,

a second word line is connected to the second memory cell, and

a first voltage is applied to the first word line and a second voltage is applied to the second word line.

10. The device according to claim 9 , wherein

a first bit line is connected to the first memory string,

a second bit line is connected to the second memory string,

a first sense amplifier is connected to the first bit line, and

a second sense amplifier is connected to the second bit line.

11. A semiconductor memory device, comprising first to nth memory cells, n being a natural number, the first to nth memory cells each having a plurality of thresholds,

the first to nth memory cells being selected simultaneously in a read operation,

after the read operation, k pieces of read data, k being n or less, being determined from n pieces of data read from the first to nth memory cells, wherein

the n is 3, and the k is 3.

12. The device according to claim 11 , wherein

the first to nth memory cells include a first state; a second state, a third state; and an hth state, h being 3 or more,

the first state and the second state are discriminated by applying a first read voltage to gates of the first to nth memory cells,

the second state and the third state are discriminated by applying a second read voltage to the gates of the first to nth memory cells,

the (h- 1 )th state and the hth state are discriminated by applying an (h- 1 )th read voltage to the gates of the first to nth memory cells, and

a voltage of the first to (h- 1 )th read voltages is applied to the first to nth memory cells in the read operation.

13. The device according to claim 11 , wherein

first to nth word lines are each connected to the first to nth memory cells, and

first to nth voltages are each applied to the first to nth word lines.

14. The device according to claim 13 , wherein

first to nth hit lines are each connected to the first to nth memory strings, and

first to nth sense amplifiers are each connected to the first to nth bit lines.

Assignments (2)
MERGER AND CHANGE OF NAME Recorded Jan 7, 2022
From: TOSHIBA MEMORY CORPORATION; K.K. PANGEA
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 058664/0198 →
CHANGE OF NAME Recorded Jan 7, 2022
From: TOSHIBA MEMORY CORPORATION
To: KIOXIA CORPORATION
Reel/Frame 058664/0544 →
Priority Claims (1)
JP JP2017-204702 · Oct 23, 2017 · national
Continuity (3)
Continuation 16874932 · May 15, 2020
Continuation 16048912 · Jul 30, 2018
Related Publication 20210125670A1 · Apr 29, 2021