IP Library Assignment 058664/0198
Patent Assignment
Reel/Frame 058664/0198

Merger and Change of Name

Recorded: 2022-01-07 Pages: 49
Assignors
TOSHIBA MEMORY CORPORATION
Executed: 2018-08-01
K.K. PANGEA
Executed: 2018-08-01
Assignee
TOSHIBA MEMORY CORPORATION
1-1, SHIBAURA 1-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Properties (24)
Semiconductor Memory Device and Method for Manufacturing Same
Application: 15/682,996 →
Publication: US 2017/0373082
Semiconductor Memory Device and Method for Manufacturing Same
Application: 15/684,286 →
Publication: US 2017/0352671
Semiconductor Memory Device and Method for Manufacturing Same
Application: 16/809,735 →
Publication: US 2020/0212062
Memory Device
Application: 16/916,979 →
Publication: US 2020/0350291
Semiconductor Memory Device
Application: 16/943,498 →
Publication: US 2020/0357810
Semiconductor Memory Device and Method for Manufacturing the Same
Application: 17/028,308 →
Publication: US 2021/0005616
Semiconductor Device and Method for Manufacturing Same
Application: 17/079,736 →
Publication: US 2021/0043546
Semiconductor Device having a Pad Proximate to a Step Structure Section of an Array Chip
Application: 17/106,414 →
Publication: US 2021/0082942
Non-Volatile Memory Device
Application: 17/128,915 →
Publication: US 2021/0111189
Semiconductor Memory Device
Application: 17/142,860 →
Publication: US 2021/0125670
Semiconductor Memory Device and Method for Manufacturing Same
Application: 17/143,632 →
Publication: US 2021/0126003
Semiconductor Device
Application: 17/149,029 →
Publication: US 2021/0134822
Semiconductor Memory Device Including a Substrate, Various Interconnections, Semiconductor Member, Charge Storage Member and a Conductive Member
Application: 17/165,169 →
Publication: US 2021/0159237
Semiconductor Device
Application: 17/185,179 →
Publication: US 2021/0183888
Semiconductor Device and Method for Manufacturing Same
Application: 17/200,987 →
Publication: US 2021/0202523
Stacked Type Semiconductor Memory Device with Varying Widths in the Insulating Member and Pillars
Application: 17/204,293 →
Publication: US 2021/0202526
Nonvolatile Semiconductor Memory Device and Method for Manufacturing Same
Application: 17/224,356 →
Publication: US 2021/0225859
Stacked-Type Semiconductor Memory Device
Application: 17/331,147 →
Publication: US 2021/0288057
Semiconductor Memory Device and Method for Manufacturing the Same
Application: 17/335,214 →
Publication: US 2021/0288073
Semiconductor Memory Device
Application: 17/376,856 →
Publication: US 2021/0343737
Transfer Molding Method with Sensor and Shut-Off Pin
Application: 17/396,053 →
Publication: US 2021/0366748
Semiconductor Memory Device
Application: 17/405,700 →
Publication: US 2021/0384214
Semiconductor Memory Device
Application: 17/407,896 →
Publication: US 2021/0384259
Plasma Treatment Apparatus, Semiconductor Manufacturing Apparatus, and Manufacturing Method of Semiconductor Device
Application: 17/483,052 →
Publication: US 2022/0013367
Related Assignments (3)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 27, 2017
From: KATO, TATSUYA; ARAI, FUMITAKA; SEKINE, KATSUYUKI; IWAMOTO, TOSHIYUKI
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 044221/0874 →
Assignment of Assignor's Interest Jan 23, 2018
From: SEKINE, KATSUYUKI; KATO, TATSUYA; ARAI, FUMITAKA; IWAMOTO, TOSHIYUKI
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 044701/0860 →
Change of Name Jan 7, 2022
From: TOSHIBA MEMORY CORPORATION
To: KIOXIA CORPORATION
Reel/Frame 058664/0544 →