Patent Assignment
Reel/Frame 048649/0581
Assignment of Assignor's Interest
Recorded: 2019-03-20
Pages: 4
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Face-To-Face Through-Silicon via Multi-Chip Semiconductor Apparatus with Redistribution Layer Packaging and Methods of Assembling Same
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.