Patent Assignment
Reel/Frame 048787/0092
Assignment of Assignor's Interest
Recorded: 2019-04-03
Pages: 4
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Die to Die Interconnect Structure for Modularized Integrated Circuit Devices
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.