Patent Assignment
Reel/Frame 049416/0459
Assignment of Assignor's Interest
Recorded: 2019-06-10
Pages: 3
Assignors
HSU, YU-HSIEN
Executed: 2019-06-06
SHIMIZU, SATOSHI
Executed: 2019-06-10
AKIMOTO, SHUNSUKE
Executed: 2019-06-10
Assignee
SANDISK TECHNOLOGIES LLC
5080 SPECTRUM DRIVE, SUITE 1050W, ADDISON, TEXAS, 75001
Covered Property
(1)
Three-Dimensional Memory Device Containing Contact via Structure Extending Through Source Contact Layer and Dielectric Spacer Assembly
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 31, 2024
From: SANDISK TECHNOLOGIES LLC
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 069796/0423 →
Partial Release of Security Interests
Apr 25, 2025
From: JPMORGAN CHASE BANK, N.A., AS AGENT
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 071382/0001 →
Security Agreement
Apr 25, 2025
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 071050/0001 →