Patent Assignment
Reel/Frame 049473/0653
Assignment of Assignor's Interest
Recorded: 2019-06-14
Pages: 5
Assignors
DENG, FELIX
Executed: 2019-06-13
OW, YUEH SHENG
Executed: 2019-06-13
KOH, TUCK FOONG
Executed: 2019-05-09
CHEN, NUNO YEN-CHU
Executed: 2019-06-13
GOH, CLINTON
Executed: 2019-06-13
Assignee
APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
8 UPPER CHANGI ROAD NORTH, APPLIED MATERIALS BUILDING, SINGAPORE, 506906, SINGAPORE
Covered Property
(1)
Methods and Apparatus for Cleaving of Semiconductor Substrates
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 14, 2019
From: WADA, YUICHI; KESAPRAGADA, SREE RANGASAI V.
To: APPLIED MATERIALS, INC.
Reel/Frame 049473/0812 →
Assignment of Assignor's Interest
Nov 5, 2019
From: APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
To: APPLIED MATERIALS, INC.
Reel/Frame 050917/0604 →