IP Library › Assignment 049473/0812
Patent Assignment
Reel/Frame 049473/0812

Assignment of Assignor's Interest

Recorded: 2019-06-14 Pages: 4
Assignors
WADA, YUICHI
Executed: 2019-06-13
KESAPRAGADA, SREE RANGASAI V.
Executed: 2019-06-09
Assignee
APPLIED MATERIALS, INC.
3050 BOWERS AVENUE, SANTA CLARA, CALIFORNIA, 95054
Covered Property (1)
Methods and Apparatus for Cleaving of Semiconductor Substrates
Application: 16/403,796 →
Publication: US 2019/0355616
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 14, 2019
From: DENG, FELIX; OW, YUEH SHENG; KOH, TUCK FOONG; CHEN, NUNO YEN-CHU
To: APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
Reel/Frame 049473/0653 →
Assignment of Assignor's Interest Nov 5, 2019
From: APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
To: APPLIED MATERIALS, INC.
Reel/Frame 050917/0604 →