IP Library › Assignment 049636/0858
Patent Assignment
Reel/Frame 049636/0858

Assignment of Assignor's Interest

Recorded: 2019-06-30 Pages: 5
Assignor
HITACHI KOKUSAI ELECTRIC INC.
Executed: 2019-06-28
Assignee
KOKUSAI ELECTRIC CORPORATION
3-4, KANDAKAJI-CHO, CHIYODA-KU, TOKYO, 101-0045, JAPAN
Covered Properties (5)
Substrate Processing Apparatus
Patent: 8,012,259 →
Application: 12/043,574 →
Publication: US 2008/0216742
Substrate Stage of Substrate Processing Apparatus and Substrate Processing Apparatus
Patent: 9,142,435 →
Application: 12/410,261 →
Publication: US 2009/0241836
Heat Treatment Apparatus
Patent: 9,074,284 →
Application: 12/768,191 →
Publication: US 2010/0275848
Substrate Processing Method and Substrate Processing Apparatus
Patent: 7,972,979 →
Application: 12/857,942 →
Publication: US 2011/0065288
Substrate Processing Apparatus Including Shielding Unit for Suppressing Leakage of Magnetic Field
Patent: 9,084,298 →
Application: 13/034,035 →
Publication: US 2011/0210118
Related Assignments (5)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest May 21, 2008
From: TAKEBAYASHI, YUJI
To: HITACHI KOKUSAI ELECTRIC INC.
Reel/Frame 020978/0783 →
Assignment of Assignor's Interest Jun 1, 2009
From: ISHISAKA, MITSUNORI
To: HITACHI KOKUSAI ELECTRIC, INC.
Reel/Frame 022759/0657 →
Assignment of Assignor's Interest Aug 11, 2010
From: FUKUDA, MASANAO; SHIRAKO, KENJI; SATO, AKIHIRO; MORIMITSU, KAZUHIRO
To: HITACHI KOKUSAI ELECTRIC, INC.
Reel/Frame 024820/0855 →
Assignment of Assignor's Interest Nov 1, 2010
From: HARADA, TORU; MINAMI, MASAYOSHI
To: HITACHI KOKUSAI ELECTRIC, INC.
Reel/Frame 025226/0906 →
Assignment of Assignor's Interest May 6, 2011
From: HIROCHI, YUKITOMO; TANAKA, AKINORI; SATO, AKIHIRO; ITOH, TAKESHI
To: HITACHI KOKUSAI ELECTRIC INC.
Reel/Frame 026237/0706 →