Patent Assignment
Reel/Frame 049777/0336
Assignment of Assignor's Interest
Recorded: 2019-07-17
Pages: 5
Assignors
CHEAH, BOK ENG
Executed: 2019-07-11
CHEE, CHOONG KOOI
Executed: 2019-07-10
KONG, JACKSON CHUNG PENG
Executed: 2019-07-12
TAN, TAT HIN
Executed: 2019-07-03
LEE, WAI LING
Executed: 2019-07-03
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Stacked Through-Silicon Vias for Multi-Device Packages
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.