Patent Assignment
Reel/Frame 050442/0700
Assignment of Assignor's Interest
Recorded: 2019-09-20
Pages: 7
Assignors
CHEN, ZHIWEI
Executed: 2019-09-13
IKAWA, YUSUKE
Executed: 2019-09-12
KAWAMURA, TAKESHI
Executed: 2019-09-12
EHARA, RYOICHI
Executed: 2019-09-12
Assignee
SANDISK TECHNOLOGIES LLC
5080 SPECTRUM DRIVE, ADDISON, TEXAS, 75001
Covered Property
(1)
Multi-Tier Three-Dimensional Memory Device with Dielectric Support Pillars and Methods for Making the Same
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 6, 2019
From: OTSU, YOSHITAKA; NOZAWA, KEI; DODA, YASHUSHI; HOJO, NAOTO
To: SANDISK TECHNOLOGIES LLC
Reel/Frame 048519/0795 →
Assignment of Assignor's Interest
Dec 31, 2024
From: SANDISK TECHNOLOGIES LLC
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 069796/0423 →
Partial Release of Security Interests
Apr 25, 2025
From: JPMORGAN CHASE BANK, N.A., AS AGENT
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 071382/0001 →
Security Agreement
Apr 25, 2025
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 071050/0001 →