Patent Assignment
Reel/Frame 050466/0764
Assignment of Assignor's Interest
Recorded: 2019-09-23
Pages: 8
Assignors
LI, HONGQI
Executed: 2013-07-29
JINDAL, ANURAG
Executed: 2013-07-31
LU, JIN
Executed: 2013-07-29
RAMALINGAM, SHYAM
Executed: 2013-07-30
Assignee
MICRON TECHNOLOGY, INC.
8000 S. FEDERAL WAY, P.O. BOX 6, BOISE, IDAHO, 83707-0006
Covered Property
(1)
Conductive Interconnect Structures Incorporating Negative Thermal Expansion Materials and Associated Systems, Devices, and Methods
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Supplement No. 8 to Patent Security Agreement
May 7, 2018
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 046084/0955 →
Security Interest
Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
Release of Security Interest
Oct 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050709/0965 →
Release of Security Interest
Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →