Patent Assignment
Reel/Frame 050486/0314
Assignment of Assignor's Interest
Recorded: 2019-09-25
Pages: 5
Assignor
CLARK, JOHN
Executed: 2018-01-16
Assignee
VEECO PRECISION SURFACE PROCESSING LLC
185 GIBRALTAR ROAD, HORSHAM, PENNSYLVANIA, 19044
Covered Property
(1)
Apparatus and Method for Wafer Thinning in Advanced Packaging Applications
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 7, 2018
From: MAUER, LAURA; TADDEI, JOHN; NULMAN, KENJI
To: VEECO PRECISION SURFACE PROCESSING LLC
Reel/Frame 047434/0556 →
Assignment of Assignor's Interest
Dec 30, 2019
From: VEECO PRECISION SURFACE PROCESSING LLC
To: VEECO INSTRUMENTS INC.
Reel/Frame 051383/0549 →
Patent Security Agreement
Dec 16, 2021
From: VEECO INSTRUMENTS INC.
To: HSBC BANK USA, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 058533/0321 →
Security Interest
Jun 16, 2025
From: VEECO INSTRUMENTS INC.
To: HSBC BANK USA, NATIONAL ASSOCIATION
Reel/Frame 071649/0225 →