IP Library › Assignment 050968/0595
Patent Assignment
Reel/Frame 050968/0595

Assignment of Assignor's Interest

Recorded: 2019-11-11 Pages: 7
Assignors
KIM, JIN SEONG
Executed: 2014-07-30
CHO, BYONG WOO
Executed: 2014-07-30
SONG, CHA GYU
Executed: 2014-07-30
Assignee
AMKOR TECHNOLOGY, INC.
2045 E. INNOVATION CIRCLE, TEMPE, ARIZONA, 85284
Covered Property (1)
Semiconductor Package Structure for Improving Die Warpage and Manufacturing Method Thereof
Application: 15/919,791 →
Publication: US 2018/0204809
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest Oct 12, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054046/0673 →