Patent Assignment
Reel/Frame 051016/0932
Assignment of Assignor's Interest
Recorded: 2019-11-15
Pages: 5
Assignee
SAMTEC, INC.
520 PARK EAST BLVD., NEW ALBANY, INDIANA, 47151
Covered Property
(1)
Method for Creating Through-Connected Vias and Conductors on a Substrate
Application:
15/634,953 →
Publication:
US 2017/0301585
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 15, 2019
From: KOELLING, FRED
To: NANOPAC TECHNOLOGIES, INC.
Reel/Frame 051016/0136 →
Assignment of Assignor's Interest
Nov 15, 2019
From: ABEXL INC.
To: SAMTEC, INC.
Reel/Frame 051016/0275 →
Change of Name
Nov 15, 2019
From: NANOPAC TECHNOLOGIES, INC.
To: ABEXL INC.
Reel/Frame 051026/0912 →