Patent Assignment
Reel/Frame 051016/0275
Assignment of Assignor's Interest
Recorded: 2019-11-15
Pages: 6
Assignor
ABEXL INC.
Executed: 2018-02-21
Assignee
SAMTEC, INC.
520 PARK EAST BOULEVARD, NEW ALBANY, INDIANA, 47151
Covered Properties
(4)
Method for Creating Through-Connected Vias and Conductors on a Substrate
Method for Creating Through-Connected Vias and Conductors on a Substrate
Application:
15/634,953 →
Publication:
US 2017/0301585
Method for Creating Through-Connected Vias and Conductors on a Substrate
System and Method for Creating Through-Connected Vias and Conductors on a Glass Substrate
Application:
62/142,458 →
Related Assignments
(8)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 28, 2015
From: KOELLING, FRED; KOELLING, BRYAN; BATINOVICH, VICTOR
To: NANOPAC TECHNOLOGIES, INC.
Reel/Frame 036674/0262 →
Assignment of Assignor's Interest
Aug 31, 2016
From: KOELLING, FRED
To: NANOPAC TECHNOLOGIES, INC.
Reel/Frame 039605/0881 →
Change of Name
May 23, 2017
From: NANOPAC TECHNOLOGIES, INC.
To: ABEXL INC.
Reel/Frame 042483/0656 →
Change of Name
Nov 15, 2019
From: NANOPAC TECHNOLOGIES, INC.
To: ABEXL INC.
Reel/Frame 051026/0912 →
Assignment of Assignor's Interest
Nov 15, 2019
From: KOELLING, FRED
To: NANOPAC TECHNOLOGIES, INC.
Reel/Frame 051016/0136 →
Assignment of Assignor's Interest
Nov 15, 2019
From: NOLET, ALAN D.; LONG, DANIEL
To: SAMTEC, INC.
Reel/Frame 051016/0932 →
Assignment of Assignor's Interest
Nov 15, 2019
From: NOLET, ALAN D.; LONG, DANIEL
To: SAMTEC, INC.
Reel/Frame 051017/0070 →
Assignment of Assignor's Interest
Jan 8, 2020
From: KOELLING, FRED
To: SAMTEC, INC.
Reel/Frame 051445/0497 →