IP Library › Assignment 051017/0070
Patent Assignment
Reel/Frame 051017/0070

Assignment of Assignor's Interest

Recorded: 2019-11-15 Pages: 5
Assignors
NOLET, ALAN D.
Executed: 2019-02-20
LONG, DANIEL
Executed: 2019-02-25
Assignee
SAMTEC, INC.
520 PARK EAST BOULEVARD, NEW ALBANY, INDIANA, 47150
Covered Property (1)
Method for Creating Through-Connected Vias and Conductors on a Substrate
Application: 15/861,518 →
Publication: US 2018/0144951
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 15, 2019
From: KOELLING, FRED
To: NANOPAC TECHNOLOGIES, INC.
Reel/Frame 051016/0136 →
Assignment of Assignor's Interest Nov 15, 2019
From: ABEXL INC.
To: SAMTEC, INC.
Reel/Frame 051016/0275 →
Change of Name Nov 15, 2019
From: NANOPAC TECHNOLOGIES, INC.
To: ABEXL INC.
Reel/Frame 051026/0912 →
Assignment of Assignor's Interest Jan 8, 2020
From: KOELLING, FRED
To: SAMTEC, INC.
Reel/Frame 051445/0497 →