IP Library Assignment 051016/0136
Patent Assignment
Reel/Frame 051016/0136

Assignment of Assignor's Interest

Recorded: 2019-11-15 Pages: 3
Assignor
KOELLING, FRED
Executed: 2016-08-30
Assignee
NANOPAC TECHNOLOGIES, INC.
860 MERIDIAN BAY LANE, #342, FOSTER CITY, CALIFORNIA, 94404
Covered Properties (2)
Method for Creating Through-Connected Vias and Conductors on a Substrate
Application: 15/634,953 →
Publication: US 2017/0301585
Method for Creating Through-Connected Vias and Conductors on a Substrate
Application: 15/861,518 →
Publication: US 2018/0144951
Related Assignments (5)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 15, 2019
From: ABEXL INC.
To: SAMTEC, INC.
Reel/Frame 051016/0275 →
Assignment of Assignor's Interest Nov 15, 2019
From: NOLET, ALAN D.; LONG, DANIEL
To: SAMTEC, INC.
Reel/Frame 051016/0932 →
Assignment of Assignor's Interest Nov 15, 2019
From: NOLET, ALAN D.; LONG, DANIEL
To: SAMTEC, INC.
Reel/Frame 051017/0070 →
Change of Name Nov 15, 2019
From: NANOPAC TECHNOLOGIES, INC.
To: ABEXL INC.
Reel/Frame 051026/0912 →
Assignment of Assignor's Interest Jan 8, 2020
From: KOELLING, FRED
To: SAMTEC, INC.
Reel/Frame 051445/0497 →