Patent Assignment
Reel/Frame 051422/0949
Assignment of Assignor's Interest
Recorded: 2020-01-06
Pages: 6
Assignors
YU, YUANGEN
Executed: 2019-12-27
HUO, ZHIJUN
Executed: 2019-12-27
ZHAO, BIN
Executed: 2019-12-27
FU, HUI
Executed: 2019-12-27
WANG, XINGXING
Executed: 2019-12-27
Assignee
SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
1525 ZHANGDONG ROAD, ZHANGJIANG HIGH-TECH PARK,, SHANGHAI, 201203, CHINA
Covered Property
(1)
Vacuumizing Device and Vacuumizing Method for Bonding Substrate
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.