IP Library › Assignment 051501/0602
Patent Assignment
Reel/Frame 051501/0602

License

Recorded: 2020-01-14 Pages: 4
Assignor
Assignee
VANGUARD INTERNATIONAL SEMICONDUCTOR SINGAPORE PTE. LTD.
1 TAMPINES INDUSTRIAL AVENUE 5, SINGAPORE, SINGAPORE
Covered Properties (3)
Package Interconnects
Patent: 8,513,767 →
Application: 13/052,134 →
Publication: US 2012/0241901
Edge Structure for Backgrinding Asymmetrical Bonded Wafer
Patent: 9,761,561 →
Application: 14/660,949 →
Publication: US 2016/0276310
Integrated Circuits with Alignment Marks and Methods of Producing the Same
Patent: 9,633,882 →
Application: 14/868,645 →
Publication: US 2017/0092523
Related Assignments (4)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 18, 2015
From: RAJOO, RANJAN; CHAN, KAI CHONG
To: GLOBALFOUNDRIES SINGAPORE PTE. LTD.
Reel/Frame 035186/0576 →
Assignment of Assignor's Interest Sep 29, 2015
From: YU, YING; SUN, JIANBO; YIN, DERUI; PRADEEP, YELEHANKA RAMACHANDRAMURTHY
To: GLOBALFOUNDRIES SINGAPORE PTE. LTD.
Reel/Frame 036678/0848 →
Security Agreement Nov 27, 2018
From: GLOBALFOUNDRIES SINGAPORE PTE. LTD.
To: WILMINGTON TRUST, NATIONAL ASSOCIATION
Reel/Frame 047660/0203 →
Release of Security Interest Nov 19, 2020
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: GLOBALFOUNDRIES SINGAPORE PTE. LTD.
Reel/Frame 054481/0673 →