Patent Assignment
Reel/Frame 051553/0311
Assignment of Assignor's Interest
Recorded: 2020-01-09
Pages: 11
Assignors
TSUCHIYA, ETSUHARU
Executed: 2019-07-16
ENOMOTO, TETSUYA
Executed: 2019-08-07
KAWAMORI, TAKASHI
Executed: 2019-07-25
SAITO, NOBUYUKI
Executed: 2019-07-16
KOIBUCHI, YUKARI
Executed: 2019-07-16
YOSHIZAWA, ATSUTARO
Executed: 2019-07-23
ASADA, AKIRA
Executed: 2019-07-16
Assignee
HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD.
4-25, KORAKU 1-CHOME, BUNKYO-KU, TOKYO, 112-0004, JAPAN
Covered Property
(1)
Photosensitive Resin Composition, Method of Manufacturing Pattern Cured Product, Cured Product, Interlayer Insulating Film, Cover-Coat Layer, Surface Protective Film, and Electronic Component
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.