Change of Name

Recorded: 2022-09-19 Pages: 10

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Assignor

HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD.

Executed: 2020-08-01

Assignee

HD MICROSYSTEMS, LTD.

4-25, KORAKU 1-CHOME, BUNKYO-KU, TOKYO, 112-0004, JAPAN

Covered Property (1)

Photosensitive Resin Composition, Method of Manufacturing Pattern Cured Product, Cured Product, Interlayer Insulating Film, Cover-Coat Layer, Surface Protective Film, and Electronic Component

Patent: 11,487,201 →

Application: 16/498,139 →

Publication: US 2021/0116809

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.

Assignment of Assignor's Interest Jan 9, 2020

From: TSUCHIYA, ETSUHARU; ENOMOTO, TETSUYA; KAWAMORI, TAKASHI; SAITO, NOBUYUKI

To: HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD.

Reel/Frame 051553/0311 →