Photosensitive resin composition, method of manufacturing pattern cured product, cured product, interlayer insulating film, cover-coat layer, surface protective film, and electronic component

1. A photosensitive resin composition consisting essentially of:

(A) a polyimide precursor having a polymerizable unsaturated bond;

(B) a polymerizable monomer having an aliphatic cyclic skeleton;

(C) a photopolymerization initiator;

(D) a solvent; and

optionally, one or more of a thermal polymerization initiator, a coupling agent, a surfactant or a leveling agent, a rust inhibitor, and a polymerization inhibitor.

2. The photosensitive resin composition according to claim 1 , wherein the component (A) is a polyimide precursor having a structural unit represented by the following formula (1):

wherein in the formula (1), X 1 is a tetravalent aromatic group, —COOR 1 group and —CONH— group are on the ortho-position to each other, —COOR 2 group and —CO— group are on the ortho-position to each other; Y 1 is a divalent aromatic group; R 1 and R 2 are independently a hydrogen atom, a group represented by the following formula (2), or an aliphatic hydrocarbon group having 1 to 4 carbon atoms; and at least one of R 1 and R 2 is a group represented by the formula (2);

wherein in the formula (2), R 3 to R 5 is independently a hydrogen atom or an aliphatic hydrocarbon group having 1 to 3 carbon atoms, and m is an integer of 1 to 10.

3. The photosensitive resin composition according to claim 1 , wherein the component (B) comprises a polymerizable monomer having a group comprising a polymerizable unsaturated double bond and having an aliphatic cyclic skeleton.

4. The photosensitive resin composition according to claim 3 , wherein the polymerizable monomer has two or more groups comprising the polymerizable unsaturated double bond.

5. The photosensitive resin composition according to claim 1 , wherein the component (B) comprises a polymerizable monomer represented by the following formula (3):

wherein in the formula (3), R 6 and R 7 are independently an aliphatic hydrocarbon group having 1 to 4 carbon atoms or a group represented by the following formula (4); n1 is 0 or 1; n2 is an integer of 0 to 2; the number of n1+n2 is 1 or more; and at least one of n1-number of R 6 and n2-number of R 7 is a group represented by the following formula (4);

wherein in the formula (4), R 9 to R 11 is independently a hydrogen atom or an aliphatic hydrocarbon group having 1 to 3 carbon atoms, and I is an integer of 0 to 10.

6. The photosensitive resin composition according to claim 5 , wherein the number of n1+n2 is 2 or 3.

7. The photosensitive resin composition according to claim 1 , wherein the component (B) comprises a polymerizable monomer represented by the following formula (5)

8. The photosensitive resin composition according to claim 1 , further comprising (E) a thermal polymerization initiator.

9. A method of manufacturing the pattern cured product comprising:

applying the photosensitive resin composition according to claim 1 on a substrate and drying the photosensitive resin composition to form a photosensitive resin film;

pattern-exposing the photosensitive resin film to obtain a resin film;

developing the resin film after the pattern exposure using an organic solvent to obtain a pattern resin film; and

heat-treating the pattern resin film.

10. The method for manufacturing the pattern cured product according to claim 9 , wherein a temperature of the heat treatment is 200° C. or less.

11. A cured product obtained by coating and then curing the photosensitive resin composition according to claim 1 .

12. The pattern cured product obtained by the method according to claim 9 .

13. An interlayer insulating film, a cover coat layer, or a surface protective film comprising the cured product according to claim 11 .

14. An electronic component comprising a semiconductor substrate having a circuit device and the interlayer insulating film, the cover coat layer, or the surface protective film according to claim 13 provided over the semiconductor substrate having the circuit device.