IP Library › Assignment 051909/0930
Patent Assignment
Reel/Frame 051909/0930

Assignment of Assignor's Interest

Recorded: 2020-02-24 Pages: 4
Assignors
LEE, CHUNG-SEOK
Executed: 2019-12-05
LEE, JOONGMOK
Executed: 2019-12-05
JEON, EUNJEONG
Executed: 2019-12-05
Assignee
SAMSUNG DISPLAY CO. LTD.
1, SAMSUNG-RO, GIHEUNG-GU, GYEONGGI-DO, YONGIN-SI, KOREA, REPUBLIC OF
Covered Property (1)
Flexible Circuit Film Bonding Apparatus and Method of Bonding Flexible Circuit Film Using the Same
Application: 16/799,811 →
Publication: US 2020/0373276
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Correct the Assignee Name Previously Recorded at Reel: 051909 Frame: 0930. Assignor(S) Hereby Confirms the Assignment. Aug 11, 2020
From: LEE, CHUNG-SEOK; LEE, JOONGMOK; JEON, EUNJEONG
To: SAMSUNG DISPLAY CO., LTD.
Reel/Frame 053464/0918 →