Flexible circuit film bonding apparatus and method of bonding flexible circuit film using the same

1. A flexible circuit film bonding apparatus, comprising:

a stage configured to support a TFT substrate;

a pressing head configured to press and heat a flexible circuit film attached on the TFT substrate with an anisotropic conductive film interposed therebetween;

a backup plate configured to support and heat the TFT substrate positioned below the flexible circuit film;

a heating control unit configured to control a temperature of a lower surface of the pressing head and an upper surface of the backup plate;

a head driving unit configured to move the pressing head in a vertical direction; and

a stage driving unit configured to move the stage along the vertical direction and a horizontal direction perpendicular to the vertical direction,

wherein the temperature of the upper surface of the backup plate is less than 170 degrees Celsius.

2. The flexible circuit film bonding apparatus of claim 1 , wherein the temperature of the lower surface of the pressing head is controlled to be higher than the temperature of the upper surface of the backup plate.

3. The flexible circuit film bonding apparatus of claim 2 , wherein the temperature of the upper surface of the backup plate is controlled to be equal to or greater than 150 degrees Celsius and less than 170 degrees Celsius.

4. The flexible circuit film bonding apparatus of claim 3 , wherein the temperature of the lower surface of the pressing head is controlled to be equal to or greater than 150 degrees Celsius and less than 200 degrees Celsius.

5. The flexible circuit film bonding apparatus of claim 1 ,

wherein the backup plate is disposed at a fixed location spaced apart from the stage.

6. The flexible circuit film bonding apparatus of claim 5 , wherein one side of the lower surface of the pressing head and one side of the upper surface of the backup plate are arranged to align in the vertical direction.

7. The flexible circuit film bonding apparatus of claim 6 , wherein the pressing head is configured to press the flexible circuit film while being spaced apart from an optical member disposed on the TFT substrate,

wherein the flexible circuit film bonding apparatus further comprises an air supply unit configured to supply air between the optical member and the pressing head to block heat generated by the pressing head from being transmitted to the optical member.

8. The flexible circuit film bonding apparatus of claim 5 , wherein the head driving unit is configured to move the pressing head at one of a first speed and a second speed, the second speed being slower than the first speed, and

the stage driving unit is configured to move the stage at a third speed in the vertical direction, the third speed being slower than the second speed.

9. A method of bonding a flexible circuit film, the method comprising:

horizontally moving a stage, a TFT substrate being disposed on the stage in a horizontal direction to position a flexible circuit film between a pressing head and a backup plate, the flexible circuit film being attached to the TFT substrate with an anisotropic conductive film interposed therebetween;

engaging the pressing head and the backup plate, comprising:

vertically moving the pressing head and one of the backup plate and the stage in a vertical direction such that a lower surface of the pressing head contacts the flexible circuit film and an upper surface of the backup plate contacts the TFT substrate;

heating and pressing the anisotropic conductive film interposed between the flexible circuit film and the TFT substrate by using the pressing head contacting the flexible circuit film and the backup plate contacting the TFT substrate, wherein a temperature of the upper surface of the backup plate is controlled to be less than 170 degrees Celsius; and

disengaging the pressing head and the backup plate, comprising:

vertically moving the pressing head and one of the backup plate and the stage in the vertical direction such that the head and the backup plate are detached from the flexible circuit film and the TFT substrate.

10. The method of claim 9 , wherein the heating and pressing of the anisotropic conductive film comprises:

controlling a temperature of the lower surface of the pressing head to be higher than the temperature of the upper surface of the backup plate.

11. The method of claim 10 , wherein the heating and pressing of the anisotropic conductive film further comprises:

controlling the temperature of the upper surface of the backup plate to be equal to or greater than 150 degrees Celsius and less than 170 degrees Celsius.

12. The method of claim 11 , wherein the heating and pressing of the anisotropic conductive film further comprises;

controlling the temperature of the lower surface of the pressing head is controlled to be equal to or greater than 150 degrees Celsius and less than 200 degrees Celsius.

13. The method of claim 9 , wherein the engaging of the pressing head and the backup plate further comprises:

vertically moving the pressing head at a first speed; and

subsequent to vertically moving of the pressing head at the first speed, vertically moving the pressing head at a second speed slower than the first speed, and the stage at a third speed slower than the second speed, simultaneously.

14. The method of claim 13 , wherein the first speed is about 5 to 20 times faster than the second speed.

15. The method of claim 13 , wherein the disengaging of pressing head and the backup plate further comprises:

vertically moving the pressing head at a fourth speed, and moving the stage vertically at a fifth speed slower than the fourth speed; and

subsequent to vertically moving of the pressing head at the fourth speed, vertically moving the pressing head vertically at a sixth speed faster than the fourth speed.

16. The method of claim 13 , wherein the horizontally moving of the stage comprises: disposing the stage such that a distance between the lower surface of the pressing head and the flexible circuit film is equal to or greater than 1.5 times a distance between the upper surface of the backup plate and the TFT substrate, and

wherein vertically moving of the pressing head at the first speed comprises: vertically moving the pressing head at the first speed such that the distance between the lower surface of the pressing head and the flexible circuit film is greater than the distance between the upper surface of the backup plate and the TFT substrate.

17. The method of claim 9 , wherein the disengaging the pressing head and the backup plate further comprises: vertically moving the pressing head and one of the backup plate and the stage in the vertical direction such that the lower surface of the pressing head contacts on the flexible circuit film after the upper surface of the backup plate contacts the TFT substrate.

18. The method of claim 9 , wherein the engaging of the pressing head and the backup plate further comprises: vertically moving the pressing head and one of the backup plate and the stage in a vertical direction such that the pressing head presses the flexible circuit film while being spaced apart from an optical member disposed on the TFT substrate, and

wherein the heating and pressing of the anisotropic conductive film comprises: providing air between the optical member and the pressing head to block heat generated by the pressing head from being transmitted to the optical member.

19. The method of claim 18 , wherein one side of the lower surface of the pressing head and one side of the upper surface of the backup plate are arranged to align in the vertical direction, and

wherein the backup plate is disposed at a fixed location spaced apart from the stage.