Patent Assignment
Reel/Frame 053464/0918
Corrective Assignment to Correct the Correct the Assignee Name Previously Recorded at Reel: 051909 Frame: 0930. Assignor(S) Hereby Confirms the Assignment.
Recorded: 2020-08-11
Pages: 8
Assignors
LEE, CHUNG-SEOK
Executed: 2019-12-05
LEE, JOONGMOK
Executed: 2019-12-05
JEON, EUNJEONG
Executed: 2019-12-05
Assignee
SAMSUNG DISPLAY CO., LTD.
1, SAMSUNG-RO, GIHEUNG-GU, GYEONGGI-DO, YONGIN-SI, KOREA, REPUBLIC OF
Covered Property
(1)
Flexible Circuit Film Bonding Apparatus and Method of Bonding Flexible Circuit Film Using the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.