IP Library › Assignment 052110/0615
Patent Assignment
Reel/Frame 052110/0615

Assignment of Assignor's Interest

Recorded: 2020-03-13 Pages: 3
Assignor
Assignee
DOW GLOBAL TECHNOLOGIES LLC
2211 H.H. DOW WAY, MIDLAND, MICHIGAN, 48674
Covered Property (1)
Thermoformed Film Compositions with Enhanced Toughness After Thermoforming Processes
Application: 16/647,238 →
Publication: US 2020/0270433
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 13, 2020
From: GARGALAKA, JOÃO, JR; MAZZOLA, NICOLAS CARDOSO; BUASZCZYK, GIANNA
To: DOW BRASIL INDÚSTRIA E COMÉRCIO DE PRODUTOS QUIMICOS LTDA.
Reel/Frame 052110/0589 →
Assignment of Assignor's Interest Mar 13, 2020
From: PEREZ, CARMELO DECLET; HANSEN, SYDNEY E.
To: DOW GLOBAL TECHNOLOGIES LLC
Reel/Frame 052110/0660 →
Assignment of Assignor's Interest Mar 13, 2020
From: PEREZ MUÑOZ, MARIA LAURA
To: PBBPOLISUR S.R.L.
Reel/Frame 052110/0712 →