Thermoformed film compositions with enhanced toughness after thermoforming processes
Embodiments of thermoformed monolayer or multilayer films are provided, wherein the thermoformed monolayer multilayer films comprise a first composition comprising at least one ethylene-based polymer, wherein the first composition comprises a Molecular Weighted Comonomer Distribution Index (MWCDI) value greater than 0.9, and a melt index ratio (I 10 /I 2 ) that meets the following equation: I 10 /I 2 ≥7.0−1.2×log (I 2 ).
1. A thermoformed multilayer film structure comprising:
a core layer and at least two outer layers disposed externally relative to the core layer,
wherein at least one layer of the thermoformed multilayer film structure comprises a first composition comprising at least one ethylene-based polymer, wherein the first composition comprises a Molecular Weighted Comonomer Distribution Index (MWCDI) value greater than 1.2, and a melt index ratio (I 10 /I 2 ) that meets the following equation: I 10 /I 2 ≥7.0−1.2×log (I 2 ).
2. The thermoformed multilayer film structure of claim 1 , wherein the thermoformed multilayer film structure comprises at least one of polyamide, ethylene vinyl alcohol (EVOH), and malleated polyolefins.
3. The thermoformed multilayer film structure of claim 1 , wherein the thermoformed multilayer film structure is substantially free of propylene-based polymers.
4. The thermoformed multilayer film structure of claim 1 , wherein the thermoformed multilayer film structure consists essentially of ethylene-based polymers.
5. The thermoformed multilayer film structure of claim 1 , wherein the core layer comprises the first composition.
6. The thermoformed multilayer film structure of claim 1 , wherein at least one of the outer layers comprises the first composition.
7. The thermoformed multilayer film structure of claim 6 , wherein the ethylene-based polymer is an ethylene-α-olefin interpolymer, where the α-olefin comprises one or more C 3 -C 12 olefins.
8. The thermoformed multilayer film structure of claim 1 , wherein at least one of the outer layers comprises propylene-based polymers.
9. The thermoformed multilayer film structure of claim 1 , wherein the thermoformed multilayer film structure has a total thickness of 50 to 250 μm.
10. An article comprising the thermoformed multilayer film structure of claim 1 .
11. The article of claim 10 , wherein the article is a flexible packaging material.
12. The thermoformed multilayer film structure of claim 1 , wherein the thermoformed multilayer film is a thermoformed blown film.
13. The thermoformed multilayer film structure of claim 1 , wherein the thermoformed multilayer film is a thermoformed cast film.
14. A thermoformed monolayer film comprising:
a first composition comprising at least one ethylene based polymer, wherein the first composition comprises a Molecular Weighted Comonomer Distribution Index (MWCDI) value greater than 1.2, and a melt index ratio (I 10 /I 2 ) that meets the following equation: I 10 /I 2 ≥7.0−1.2×log (I 2 ),
wherein the thermoformed monolayer film demonstrates an increase in puncture resistance of at least 10% due to thermoforming applications.
15. The thermoformed monolayer film of claim 14 , wherein the thermoformed monolayer film structure consists essentially of ethylene based polymer.
16. The thermoformed monolayer film of claim 14 , wherein the thermoformed monolayer film structure has a total thickness of 50 to 250 μm.
17. An article comprising the thermoformed monolayer film structure of claim 14 .
18. The article of claim 17 , wherein the article is a flexible packaging material.
19. The thermoformed monolayer film structure of claim 14 , wherein the thermoformed monolayer film is a thermoformed blown film.
20. The thermoformed monolayer film structure of claim 14 , wherein the thermoformed monolayer film is a thermoformed cast film.