Patent Assignment
Reel/Frame 052110/0660
Assignment of Assignor's Interest
Recorded: 2020-03-13
Pages: 4
Assignee
DOW GLOBAL TECHNOLOGIES LLC
2211 H.H. DOW WAY, MIDLAND, MICHIGAN, 48674
Covered Property
(1)
Thermoformed Film Compositions with Enhanced Toughness After Thermoforming Processes
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 13, 2020
From: GARGALAKA, JOÃO, JR; MAZZOLA, NICOLAS CARDOSO; BUASZCZYK, GIANNA
To: DOW BRASIL INDÚSTRIA E COMÉRCIO DE PRODUTOS QUIMICOS LTDA.
Reel/Frame 052110/0589 →
Assignment of Assignor's Interest
Mar 13, 2020
From: DOW BRASIL INDÚSTRIA E COMÉRCIO DE PRODUTOS QUIMICOS LTDA.
To: DOW GLOBAL TECHNOLOGIES LLC
Reel/Frame 052110/0615 →
Assignment of Assignor's Interest
Mar 13, 2020
From: PEREZ MUÑOZ, MARIA LAURA
To: PBBPOLISUR S.R.L.
Reel/Frame 052110/0712 →