Patent Assignment
Reel/Frame 052120/0493
Assignment of Assignor's Interest
Recorded: 2020-03-16
Pages: 12
Assignors
ZHAO, CHONG J.
Executed: 2020-01-10
MCCALL, JAMES A.
Executed: 2020-01-30
TOMISHIMA, SHIGEKI
Executed: 2020-01-10
VERGIS, GEORGE
Executed: 2020-03-12
BAINS, KULJIT S.
Executed: 2020-01-10
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Techniques to Couple High Bandwidth Memory Device on Silicon Substrate and Package Substrate
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.