Patent Assignment
Reel/Frame 052176/0752
Assignment of Assignor's Interest
Recorded: 2020-03-20
Pages: 15
Assignor
INTERNATIONAL BUSINESS MACHINES CORPORATION
Executed: 2019-12-27
Assignee
TESSERA, INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Semiconductor Device Including a Porous Dielectric Layer, and Method of Forming the Semiconductor Device
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 12, 2020
From: BRIGGS, BENJAMIN DAVID; CLEVENGER, LAWRENCE A.; DEPROSPO, BARTLET H.; HUANG, HUAI
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 052161/0782 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Certificate of Conversion & Change of Name
Sep 7, 2022
From: TESSERA, INC.
To: TESSERA LLC
Reel/Frame 061388/0199 →
Change of Name
Sep 27, 2024
From: TESSERA LLC
To: ADEIA SEMICONDUCTOR SOLUTIONS LLC
Reel/Frame 069067/0448 →