IP Library › Assignment 052524/0893
Patent Assignment
Reel/Frame 052524/0893

Assignment of Assignor's Interest

Recorded: 2020-04-29 Pages: 4
Assignors
GRIVNA, GORDON M.
Executed: 2017-02-27
ST. GERMAIN, STEPHEN
Executed: 2017-02-27
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 EAST MCDOWELL ROAD, MD A700, PHOENIX, ARIZONA, 85008
Covered Property (1)
Semiconductor Device and Method for Supporting Ultra-Thin Semiconductor Die
Application: 16/861,615 →
Publication: US 2020/0258739
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Aug 27, 2020
From: FAIRCHILD SEMICONDUCTOR CORPORATION; SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 053613/0621 →
Release of Security Interest in Patents Previously Recorded at Reel 053613, Frame 0621 Aug 17, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064618/0942 →