IP Library › Assignment 052613/0495
Patent Assignment
Reel/Frame 052613/0495

Assignment of Assignor's Interest

Recorded: 2020-05-08 Pages: 3
Assignors
CHENG, CHUNG-LIANG
Executed: 2018-01-29
CHEN, YEN-YU
Executed: 2018-02-01
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property (1)
Dual Metal Via for Contact Resistance Reduction
Application: 16/870,360 →
Publication: US 2020/0273966
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 23, 2022
From: CHENG, CHUNG-LIANG; CHEN, YEN-YU
To: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD
Reel/Frame 060872/0749 →