Patent Assignment
Reel/Frame 060872/0749
Assignment of Assignor's Interest
Recorded: 2022-08-23
Pages: 3
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Dual Metal Via for Contact Resistance Reduction
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.