Patent Assignment
Reel/Frame 052646/0405
Assignment of Assignor's Interest
Recorded: 2020-05-12
Pages: 2
Assignor
OKAMOTO, MASAKI
Executed: 2015-12-21
Assignee
SONY CORPORATION
1-7-1 KONAN, MINATO-KU, TOKYO, 108-0075, JAPAN
Covered Properties
(3)
Semiconductor Device, Manufacturing Method Thereof, Solid-State Imaging Device, and Electronic Apparatus
Semiconductor Device, Manufacturing Method Thereof, Solid-State Imaging Device, and Electronic Apparatus
Semiconductor Device, Manufacturing Method Thereof, Solid-State Imaging Device, and Electronic Apparatus with Multi-Layer Interconnects