IP Library › Assignment 052803/0716
Patent Assignment
Reel/Frame 052803/0716

Assignment of Assignor's Interest

Recorded: 2020-06-01 Pages: 3
Assignors
ODA, NORIAKI
Executed: 2020-05-28
OKINA, TERUO
Executed: 2020-05-28
Assignee
SANDISK TECHNOLOGIES LLC
5080 SPECTRUM DRIVE, SUITE 1050W, ADDISON, TEXAS, 75001
Covered Property (1)
Semiconductor Die Including Diffusion Barrier Layers Embedding Bonding Pads and Methods of Forming the Same
Application: 16/888,055 →
Publication: US 2021/0375790
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 31, 2024
From: SANDISK TECHNOLOGIES LLC
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 069796/0423 →
Security Agreement Apr 25, 2025
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 071050/0001 →
Partial Release of Security Interests Apr 25, 2025
From: JPMORGAN CHASE BANK, N.A., AS AGENT
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 071382/0001 →