IP Library › Assignment 052828/0760
Patent Assignment
Reel/Frame 052828/0760

Assignment of Assignor's Interest

Recorded: 2020-06-03 Pages: 3
Assignors
NISHIDA, AKIO
Executed: 2019-03-04
MUSHIGA, MITSUTERU
Executed: 2019-03-04
Assignee
SANDISK TECHNOLOGIES LLC
5080 SPECTRUM DRIVE, SUITE 1050W, ADDISON, TEXAS, 75001
Covered Property (1)
Three-Dimensional Device with Bonded Structures Including a Support Die and Methods of Making the Same
Application: 16/891,843 →
Publication: US 2020/0295043
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 31, 2024
From: SANDISK TECHNOLOGIES LLC
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 069796/0423 →
Partial Release of Security Interests Apr 25, 2025
From: JPMORGAN CHASE BANK, N.A., AS AGENT
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 071382/0001 →
Security Agreement Apr 25, 2025
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 071050/0001 →