Three-dimensional device with bonded structures including a support die and methods of making the same
A memory die including a three-dimensional array of memory elements and a logic die including a peripheral circuitry that support operation of the three-dimensional array of memory elements can be bonded by die-to-die bonding to provide a bonded assembly. External bonding pads for the bonded assembly can be provided by forming recess regions through the memory die or through the logic die to physically expose metal interconnect structures within interconnect-level dielectric layers. The external bonding pads can include, or can be formed upon, a physically exposed subset of the metal interconnect structures. Alternatively or additionally, laterally-insulated external connection via structures can be formed through the bonded assembly to multiple levels of the metal interconnect structures. Further, through-dielectric external connection via structures extending through a stepped dielectric material portion of the memory die can be physically exposed, and external bonding pads can be formed thereupon.
1. A bonded assembly comprising:
a first semiconductor die comprising a first substrate including a first distal planar surface and a first proximal planar surface, first semiconductor devices located on, or over, the first proximal planar surface of the first substrate, first interconnect-level dielectric layers including first metal interconnect structures that are electrically connected to the first semiconductor devices, and first die-to-die bonding pads located at a surface portion of the first interconnect-level dielectric layers and electrically connected to the first metal interconnect structures; and
a second semiconductor die comprising a second substrate including a second distal planar surface and a second proximal planar surface, second semiconductor devices located on, or over, the second proximal planar surface of the second substrate, second interconnect-level dielectric layers including second metal interconnect structures that are electrically connected to the second semiconductor devices, and second die-to-die bonding pads located at a surface portion of the second interconnect-level dielectric layers and electrically connected to the second metal interconnect structures,
wherein:
the second die-to-die bonding pads are bonded to the first die-to-die bonding pads to provide die-to-die bonding between the first semiconductor die and the second semiconductor die; and
an external bonding pad located entirely between a first horizontal plane including the first proximal planar surface of the first substrate and a second horizontal plane including the second proximal planar surface of the second substrate.
2. The bonded assembly of claim 1 , further comprising a solder ball bonded to the external bonding pad.
3. The bonded assembly of claim 1 , wherein the second die-to-die bonding pads are bonded to the first die-to-die bonding pads by copper-to-copper bonding.
4. The bonded assembly of claim 1 , further comprising a recess region including a void, wherein the recess region vertically extends from the second distal planar surface through the second proximal planar surface.
5. The bonded assembly of claim 4 , wherein the recess region comprises at least one vertical or substantially vertical sidewall that continuously extends from the second distal planar surface to a surface of the external bonding pad.
6. The bonded assembly of claim 4 , wherein the external bonding pad is located directly on, or is included within, one of the second interconnect-level dielectric layers in the second semiconductor die.
7. The bonded assembly of claim 4 , wherein the external bonding pad is located directly on, or is included within, one of the first interconnect-level dielectric layers in the first semiconductor die.
8. The bonded assembly of claim 7 , wherein an edge of an interface between the first semiconductor die and the second semiconductor die is physically exposed to the recess region.
9. The bonded assembly of claim 1 , wherein:
one of the first semiconductor die and the second semiconductor die comprises a memory die including a three-dimensional array of memory elements; and
another of the first semiconductor die and the second semiconductor die comprises a logic die including a peripheral circuitry configured to operate the three-dimensional array of memory elements.
10. The bonded assembly of claim 9 , wherein:
the first substrate and the second substrate comprise semiconductor substrates;
the memory die comprises a set of word lines for the three-dimensional array of memory elements and a set of bit lines for the three-dimensional array of memory elements; and
the peripheral circuitry is configured to drive at least one set among the set of word lines and the set of bit lines.
11. The bonded assembly of claim 10 , wherein the memory die comprises:
an alternating stack of insulating layers and electrically conductive layers; and
a two-dimensional array of memory stack structures that extend through the alternating stack,
wherein:
each of the memory stack structures comprises a respective vertical stack of memory elements located adjacent to a respective vertical semiconductor channel;
the two-dimensional array of memory stack structures constitutes the three-dimensional array of memory elements;
the bit lines are connected to a respective subset of the vertical semiconductor channels; and
the electrically conductive layers comprise the word lines.
12. The bonded assembly of claim 1 , wherein the external bonding pad is electrically connected to one of the first die-to-die bonding pads and the second die-to-die bonding pads by a vertically-extending portion of the external bonding pad or a vertically extending conductive structure that directly contacts the external bonding pad and one of the first die-to-die bonding pads and the second die-to-die bonding pads.