Patent Assignment
Reel/Frame 052998/0534
Assignment of Assignor's Interest
Recorded: 2020-06-22
Pages: 3
Assignor
GRIVNA, GORDON M.
Executed: 2017-03-08
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 EAST MCDOWELL ROAD, MD A700, PHOENIX, ARIZONA, 85008
Covered Property
(1)
Semiconductor Device and Method of Forming Backside Openings for an Ultra-Thin Semiconductor Die
Application:
16/907,520 →
Publication:
US 2020/0321291
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Aug 27, 2020
From: FAIRCHILD SEMICONDUCTOR CORPORATION; SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 053613/0621 →
Release of Security Interest in Patents Previously Recorded at Reel 053613, Frame 0621
Aug 17, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064618/0942 →