Patent Assignment
Reel/Frame 053154/0059
Assignment of Assignor's Interest
Recorded: 2020-07-08
Pages: 3
Assignors
DELACRUZ, JAVIER A.
Executed: 2020-07-08
HABA, BELGACEM
Executed: 2020-07-08
REGEV, GUY
Executed: 2020-07-08
Assignee
INVENSAS BONDING TECHNOLOGIES, INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Security Circuitry for Bonded Structures
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 14, 2020
From: DELACRUZ, JAVIER A.; HABA, BELGACEM; REGEV, GUY
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 053207/0086 →
Security Interest
May 3, 2023
From: ADEIA GUIDES INC.; ADEIA IMAGING LLC; ADEIA MEDIA HOLDINGS LLC; ADEIA MEDIA SOLUTIONS INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 063529/0272 →
Change of Name
Jul 11, 2024
From: INVENSAS BONDING TECHNOLOGIES, INC.
To: ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Reel/Frame 068283/0730 →