Patent Assignment
Reel/Frame 068283/0730
Change of Name
Recorded: 2024-07-11
Pages: 4
Assignor
INVENSAS BONDING TECHNOLOGIES, INC.
Executed: 2022-08-15
Assignee
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Security Circuitry for Bonded Structures
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 8, 2020
From: DELACRUZ, JAVIER A.; HABA, BELGACEM; REGEV, GUY
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 053154/0059 →
Assignment of Assignor's Interest
Jul 14, 2020
From: DELACRUZ, JAVIER A.; HABA, BELGACEM; REGEV, GUY
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 053207/0086 →
Security Interest
May 3, 2023
From: ADEIA GUIDES INC.; ADEIA IMAGING LLC; ADEIA MEDIA HOLDINGS LLC; ADEIA MEDIA SOLUTIONS INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 063529/0272 →