Patent Assignment
Reel/Frame 053171/0798
Assignment of Assignor's Interest
Recorded: 2020-07-10
Pages: 11
Assignors
SHIMIZU, MARI
Executed: 2020-06-05
FUJIMOTO, DAISUKE
Executed: 2020-06-05
KAMIGATA, YASUO
Executed: 2020-06-09
KOTAKE, TOMOHIKO
Executed: 2020-06-05
TAKANEZAWA, SHIN
Executed: 2020-06-05
SHIMIZU, AKIRA
Executed: 2020-06-05
NEGISHI, HARUMI
Executed: 2020-06-05
AOYAGI, KOUICHI
Executed: 2020-06-05
KIKUCHI, SAYAKA
Executed: 2020-06-05
Assignee
HITACHI CHEMICAL COMPANY, LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Prepreg, Laminate, and Production Methods Therefor, as Well as Printed Circuit Board and Semiconductor Package
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 9, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066547/0677 →