Patent Assignment
Reel/Frame 053602/0477
Assignment of Assignor's Interest
Recorded: 2020-08-26
Pages: 4
Assignors
JEONG, CHANG BU
Executed: 2020-08-18
PARK, JONG SUNG
Executed: 2020-08-18
KIM, JUNG SUB
Executed: 2020-08-18
PARK, YOUNG GUN
Executed: 2020-08-18
CHOI, DAE SEOK
Executed: 2020-08-18
JUNG, SANG HOON
Executed: 2020-08-18
Assignee
SEMES CO., LTD.
77, 4SANDAN 5-GIL, JIKSAN-EUP, SEOBUK-GU, CHEONAN-SI, CHUNGCHEONGNAM-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Die Pickup Module and Die Bonding Apparatus Including the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.