Patent Assignment
Reel/Frame 054899/0784
Assignment of Assignor's Interest
Recorded: 2021-01-05
Pages: 4
Assignors
LEE, MIN GU
Executed: 2020-12-22
CHOI, EUI SUN
Executed: 2020-12-22
LEE, KANG SAN
Executed: 2020-12-22
MIN, DAE HO
Executed: 2020-12-22
SEOK, SEUNG DAE
Executed: 2020-12-22
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU,SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Die Pickup Module and Die Bonding Apparatus Including the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.