Die pickup module and die bonding apparatus including the same

1. A die pickup module comprising:

a wafer stage for supporting a wafer including dies attached on a dicing tape;

a die ejector arranged under the dicing tape and for separating a die to be picked up from the dicing tape;

a non-contact picker for picking up the die in a non-contact manner so as not to contact a front surface of the die;

a vertical driving unit for moving the non-contact picker in a vertical direction to pick up the die; and

an inverting driving unit for inverting the non-contact picker to invert a die picked up by the non-contact picker, the non-contact picker maintaining the die in the non-contact manner so as not to contact the front surface of the die when inverted by the inverting driving unit.

2. The die pickup module of claim 1 ,

wherein the non-contact picker includes an ultrasonic vibration unit for maintaining the die in a non-contact state using ultrasonic vibration.

3. The die pickup module of claim 1 ,

wherein the non-contact picker includes,

an ultrasonic vibration unit for providing repulsive force to push the die using ultrasonic vibration, and

a vacuum chuck for providing suction force to the die using a vacuum pressure so that the die is maintained in a non-contact state.

4. The die pickup module of claim 1 ,

wherein the non-contact picker includes,

an ultrasonic vibration unit for providing repulsive force to push the die using ultrasonic vibration, and

a Bernoulli chuck for forming a flow of air on the die so as to maintain the die in a non-contact state and providing suction force to the die using negative pressure generated by the flow of air.

5. The die pickup module of claim 2 ,

wherein the ultrasonic vibration unit includes,

an ultrasonic vibrator for generating the ultrasonic vibration,

a horn for transmitting the ultrasonic vibration, and

a vibration plate connected to the horn and vibrated by the ultrasonic vibration.

6. The die pickup module of claim 3 ,

wherein the vacuum chuck is coupled to an end of the ultrasonic vibration unit and has vacuum holes for forming the suction force,

wherein the vacuum holes are connected to a vacuum pump through a vacuum line passing through the ultrasonic vibration unit.

7. The die pickup module of claim 4 ,

wherein the Bernoulli chuck is coupled to an end of the ultrasonic vibration unit and has an air injection nozzle for forming the flow of air and vacuum holes for sucking air injected from the air injection nozzle,

wherein the air injection nozzle is connected to an air supplying unit for supplying the air through an air line passing through the ultrasonic vibration unit.

8. The die pickup module of claim 1 ,

wherein the die ejector includes,

ejector members arranged in a telescope shape, and

an ejector driving unit for simultaneously raising the ejector members and sequentially descending the ejector members one by one from outside to inside.

9. The die pickup module of claim 8 ,

wherein the ejector driving unit includes,

disc-shaped flanges each formed in a horizontal direction in a lower end portion of the ejector members, arranged in a vertical direction, and having a diameter gradually increasing upward,

a driving head arranged in a lower portion of the flanges and having a circular ring shaped upper surfaces respectively facing lower surfaces of the flanges,

a head driving unit for rotating the driving head, and

cam followers mounted in a lower portion of the flanges and placed on upper surfaces of the driving head,

wherein the upper surfaces of the driving head have first inclined surfaces for simultaneous rise of the ejector members and second inclined surfaces for sequential descend of the ejector members.

10. The die pickup module of claim 9 ,

wherein the driving head includes a permanent magnet for providing a magnetic force so that the cam followers are in close contact with upper surfaces of the driving head.

11. The die pickup module of claim 8 ,

wherein the die ejector further includes a stopper member for maintaining a gap between the ejector members.

12. The die pickup module of claim 8 ,

wherein the die ejector further includes,

a hood having an opening, into which the ejector members are inserted, and vacuum holes for vacuum adsorbing the dicing tape, and

an ejector body coupled to the hood and in a cylinder shape with a closed lower portion.

13. A die bonding apparatus comprising:

a die pickup module for picking up a die to be picked up from a wafer including dies attached on a dicing tape and inverting the picked up die; and

a die bonding module for bonding a die inverted by the die pickup module on a substrate,

wherein the die pickup module includes,

a wafer stage for supporting the wafer;

a die ejector arranged under the dicing tape and for separating the die from the dicing tape;

a non-contact picker for picking up the die in a non-contact manner so as not to contact a front surface of the die;

a vertical driving unit for moving the non-contact picker in a vertical direction to pick up the die; and

an inverting driving unit for inverting the non-contact picker to invert the die so that a rear surface of the die picked up by the non-contact picker faces upward, the non-contact picker maintaining the die in the non-contact manner so as not to contact the front surface of the die when inverted by the inverting driving unit.

14. The die pickup module of claim 3 ,

wherein the ultrasonic vibration unit includes,

an ultrasonic vibrator for generating the ultrasonic vibration,

a horn for transmitting the ultrasonic vibration, and

a vibration plate connected to the horn and vibrated by the ultrasonic vibration.

15. The die pickup module of claim 4 ,

wherein the ultrasonic vibration unit includes,

an ultrasonic vibrator for generating the ultrasonic vibration,

a horn for transmitting the ultrasonic vibration, and

a vibration plate connected to the horn and vibrated by the ultrasonic vibration.