IP Library › Assignment 053612/0312
Patent Assignment
Reel/Frame 053612/0312

Assignment of Assignor's Interest

Recorded: 2020-08-27 Pages: 8
Assignors
PATIL, PATIL
Executed: 2020-08-14
BUOT, JOAN REY VILLARBA
Executed: 2020-08-11
WE, HONG BOK
Executed: 2020-08-12
Assignee
QUALCOMM INCORPORATED
5775 MOREHOUSE DRIVE, SAN DIEGO, CALIFORNIA, 92121-1714
Covered Property (1)
Package and Substrate Comprising Interconnects with Semi-Circular Planar Shape and/or Trapezoid Planar Shape
Application: 17/002,615 →
Publication: US 2022/0068798
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the to Correct Inventor 1 as Aniket Patil Previously Recorded at Reel: 053612 Frame: 0312. Assignor(S) Hereby Confirms the Assignment. Feb 23, 2022
From: PATIL, ANIKET; BUOT, JOAN REY VILLARBA; WE, HONG BOK
To: QUALCOMM INCORPORATED
Reel/Frame 059220/0230 →