Package and substrate comprising interconnects with semi-circular planar shape and/or trapezoid planar shape
A substrate that includes at least one dielectric layer, a plurality of first interconnects located in the at least one dielectric layer, at least one photo-imageable dielectric layer coupled to the at least one dielectric layer, and a plurality of second interconnects located in the at least one photo-imageable dielectric layer. The plurality of second interconnects includes at least one pair of adjacent interconnects having a centroid to centroid distance that is less than a pitch between the pair of interconnects. The pair of adjacent interconnects may include a pair of adjacent via interconnects and/or a pair of pad interconnects. The substrate may include a coreless substrate or a cored substrate.
1. A substrate comprising:
at least one dielectric layer;
a plurality of first interconnects located in the at least one dielectric layer;
at least one photo-imageable dielectric layer coupled to the at least one dielectric layer; and
a plurality of second interconnects located in the at least one photo-imageable dielectric layer, the plurality of second interconnects comprising at least one pair of adjacent via interconnects having a centroid to centroid distance that is less than a pitch between the pair of adjacent via interconnects.
2. The substrate of claim 1 , wherein a centroid of a via interconnect from the at least one pair of adjacent via interconnects is a position of a center of mass of the via interconnect.
3. The substrate of claim 1 , wherein a centroid of a via interconnect from the at least one pair of adjacent via interconnects is a point or line that represents a mean position of the via interconnect.
4. The substrate of claim 1 , wherein the pitch between the pair of adjacent via interconnects is a center to center distance between the pair of adjacent via interconnects.
5. The substrate of claim 1 , wherein the pair of adjacent via interconnects includes a via interconnect having a semi-circular planar shape and/or a trapezoid planar shape.
6. The substrate of claim 1 ,
wherein the plurality of second interconnects further comprises at least one pair of adjacent pad interconnects having a centroid to centroid distance that is less than a pitch between the pair of adjacent pad interconnects, and
wherein the pair of adjacent pad interconnects is coupled to the pair of adjacent via interconnects.
7. The substrate of claim 1 , wherein the pair of adjacent via interconnects comprises:
a first via interconnect configured to provide a path for a first electrical current; and
a second via interconnect configured to provide a path for a second electrical current.
8. The substrate of claim 7 ,
wherein the first via interconnect is part of a first netlist circuit, and
wherein the second via interconnect is part of a second netlist circuit.
9. The substrate of claim 1 , wherein the pair of adjacent via interconnects comprises:
a first via interconnect configured to provide a path for a first electrical signal; and
a second via interconnect configured to provide a path for ground.
10. The substrate of claim 1 , wherein the pair of adjacent via interconnects comprises:
a first via interconnect configured to provide a path for a power; and
a second via interconnect configured to provide a path for ground.
11. The substrate of claim 1 , wherein the pair of adjacent via interconnects comprises:
a first via interconnect; and
a second via interconnect configured to provide a second electrical current, wherein the second electrical current is configured to induce a first electrical current through the first via interconnect.
12. The substrate of claim 1 , wherein the substrate includes a coreless substrate or a cored substrate that includes a core layer.
13. A substrate comprising:
at least one dielectric layer;
a plurality of first interconnects located in the at least one dielectric layer;
at least one photo-imageable dielectric layer coupled to the at least one dielectric layer; and
a plurality of second interconnects located in the at least one photo-imageable dielectric layer, wherein the plurality of second interconnects comprises at least one via interconnect having a semi-circular planar shape.
14. The substrate of claim 13 , wherein the plurality of second interconnects comprises:
a first via interconnect having a first semi-circular planar shape; and
a second via interconnect directly adjacent to the first via interconnect, wherein the second via interconnect has a second semi-circular planar shape.
15. The substrate of claim 14 , wherein the first semi-circular planar shape is a mirror image of the second semi-circular planar shape.
16. The substrate of claim 13 , wherein the plurality of second interconnects comprises at least one via interconnect having a trapezoid planar shape.
17. An apparatus comprising:
an integrated device;
a substrate coupled to the integrated device, the substrate comprising:
at least one dielectric layer;
a plurality of first interconnects located in the at least one dielectric layer;
at least one photo-imageable dielectric layer coupled to the at least one dielectric layer; and
a plurality of second interconnects located in the at least one photo-imageable dielectric layer, the plurality of second interconnects comprising at least one pair of adjacent via interconnects having a centroid to centroid distance that is less than a pitch between the pair of adjacent via interconnects.
18. The apparatus of claim 17 , wherein a centroid of a via interconnect from the at least one pair of adjacent via interconnect is a position of a center of mass of the via interconnect.
19. The apparatus of claim 17 , wherein a centroid of a via interconnect from the at least one pair of adjacent via interconnects is a point or line that represents a mean position of the via interconnect.
20. The apparatus of claim 17 , wherein the pitch between the pair of adjacent via interconnects is a center to center distance between the pair of adjacent via interconnects.
21. The apparatus of claim 17 , wherein the pair of adjacent via interconnects includes a via interconnect having a semi-circular planar shape and/or a trapezoid planar shape.
22. The apparatus of claim 17 , wherein the apparatus includes a music player, a video player, an entertainment unit, a navigation device, a communications device, a mobile device, a mobile phone, a smartphone, a personal digital assistant, a fixed location terminal, a tablet computer, a computer, a wearable device, a laptop computer, a server, an internet of things (IoT) device, and/or a device in an automotive vehicle.
23. A method for fabricating a substrate, comprising:
forming at least one dielectric layer;
forming a plurality of first interconnects in the at least one dielectric layer;
forming at least one photo-imageable dielectric layer over the at least one dielectric layer; and
forming a plurality of second interconnects in the at least one photo-imageable dielectric layer, wherein forming the plurality of second interconnects comprises forming at least one pair of adjacent interconnects having a centroid to centroid distance that is less than a pitch between the pair of adjacent interconnects.
24. The method of claim 23 , wherein a centroid of an interconnect from the at least one pair of adjacent interconnects is a position of a center of mass of the interconnect.
25. The method of claim 23 , wherein a centroid of an interconnect from the at least one pair of adjacent interconnects is a point or line that represents a mean position of the interconnect.
26. The method of claim 23 , wherein the pitch between the pair of adjacent interconnects is a center to center distance between the pair of adjacent interconnects.
27. The method of claim 23 , wherein forming the plurality of second interconnects comprises forming at least one via interconnect having a semi-circular planar shape and/or a trapezoid planar shape.
28. The method of claim 23 , wherein forming the plurality of second interconnects comprises forming at least one via interconnect having a non-full circular planar shape and a non-rectangular planar shape.
29. The method of claim 23 , wherein the pair of adjacent interconnects includes a pair of adjacent via interconnects and/or a pair of adjacent pad interconnects.