Corrective Assignment to Correct the to Correct Inventor 1 as Aniket Patil Previously Recorded at Reel: 053612 Frame: 0312. Assignor(S) Hereby Confirms the Assignment.

Recorded: 2022-02-23 Pages: 10

Assignors

PATIL, ANIKET

Executed: 2020-08-14

BUOT, JOAN REY VILLARBA

Executed: 2020-08-11

WE, HONG BOK

Executed: 2020-08-12

Assignee

QUALCOMM INCORPORATED

5775 MOREHOUSE DRIVE, SAN DIEGO, CALIFORNIA, 92121-1714

Covered Property (1)

Package and Substrate Comprising Interconnects with Semi-Circular Planar Shape and/or Trapezoid Planar Shape

Patent: 11,296,022 →

Application: 17/002,615 →

Publication: US 2022/0068798

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.