IP Library › Assignment 053815/0983
Patent Assignment
Reel/Frame 053815/0983

Assignment of Assignor's Interest

Recorded: 2020-09-18 Pages: 4
Assignors
DAI, KE
Executed: 2020-09-09
WEI, JIAN
Executed: 2020-09-09
YAN, JIAJIA
Executed: 2020-09-09
Assignee
SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD
20F, SILERGY MANSION, NO. 6, LIANHUI STREET, BINJIANG DISTRICT, HANGZHOU, ZHEJIANG PROVINCE, 310051, CHINA
Covered Property (1)
Package Assembly and Method for Manufacturing the Same, Package Assembly of Buck Converter
Application: 17/025,106 →
Publication: US 2021/0098329
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 6, 2021
From: SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD.
To: HEFEI SILERGY SEMICONDUCTOR TECHNOLOGY CO., LTD.
Reel/Frame 058912/0311 →