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Patent Assignment
Reel/Frame 058912/0311

Assignment of Assignor's Interest

Recorded: 2021-12-06 Pages: 2
Assignor
Assignee
HEFEI SILERGY SEMICONDUCTOR TECHNOLOGY CO., LTD.
NO. 1#368, BRAINSTORMING SPACE, SOFTWARE PARK, NO. 10 TIANTONG ROAD, HIGH-TECH ZONE, HEFEI CITY, ANHUI PROVINCE, 230088, CHINA
Covered Property (1)
Package Assembly and Method for Manufacturing the Same, Package Assembly of Buck Converter
Application: 17/025,106 →
Publication: US 2021/0098329
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 18, 2020
From: DAI, KE; WEI, JIAN; YAN, JIAJIA
To: SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD
Reel/Frame 053815/0983 →